Push-Up Needles separate a
diced Integrated Circuit Chip or an LED Device from Adhesive
Film. The chip or device are picked up by a collet and carried
to the next stage of the bonding process.
The smooth, highly polished taper and small angle of the
needle’s tip allows for a gentle separation dice from the
Adhesive Film. A long life span for the diamond push-up needles
can be realized because of highly wear resistance of the material.
Specifications:
･Minimum Outer Diameter: φ0.4 mm
･Minimum Tip Radius: 10um
